BASF Material Solutions for Power Electronics Jasmina Simon, Jochen Seubert, Thomas Bayerl, Patrick Frey Ludwigshafen am Rhein December 5th, 2023 1 05.12.2023 | BASF Material Solutions for Power Electronics Market Transformation: Megatrend? Current Situation Future Situation Relevant for Power Electronics Thermal Electricity 2 05.12.2023 | BASF Material Solutions for Power Electronics Market Transformation: Megatrend? Metal replacement 3 05.12.2023 | BASF Material Solutions for Power Electronics Busbars IGBTs Requirements and Solutions - Inverters Why always in metal? – Potential for plastic housings Key properties & features • Non-conductive housing materials • Improved NVH performance through superior damping • Unleash design freedom without post processing Customer benefits • Functional integration reduces assembly effort Source: A2Mac1.com • Lower carbon footprint via material & weight saving • Reduced total cost of ownership Source: A2Mac1.com 4 05.12.2023 | BASF Material Solutions for Power Electronics Requirements and Solutions - Inverters EMI shielding High voltage circuits on-board Generation of electromagnetic fields EMI shielding is a must have for eMobility Electro Magnetic Interference shielding (EMI) … requires electrically conductive materials Shielding efficiency to protect signals 20 40 60 80 1% 0.01% 0.0001% 0.000001% SE [dB] Battery 5 Power electronics 05.12.2023 | BASF Material Solutions for Power Electronics E-Motor Transmitted power Requirements and Solutions - Inverters EMI shielding Conductive plastics ◼ Shielding efficiency dependent on filling degree and material ◼ Cost-weight-competitiveness vs. metals Shielding efficiency 80 dB Conductive coatings ◼ Very good shielding efficiency 60 dB Coatings / Hybrid films ◼ Cost-efficient and lighter than complex aluminum die cast structures Hybrid films ◼ Shielding efficiency comparable to metals ◼ Functionalization of metal sheets by polymeric overmolding 6 05.12.2023 | BASF Material Solutions for Power Electronics Steel fiber fillers Performance Carbon fillers Cost Aluminum reference Weight Density Requirements and Solutions - Inverters EMI shielding Conductive plastics • • Ultramid® A3WC4 Ultradur® B4300C3 Shielding efficiency 80 dB Conductive coatings Potential substrate grades • Ultramid® B3U42G6 • Ultramid® Exp. A3U44G7 + EMI coating by partner Hybrid films Metal films with adhesive polymer layer suitable for overmolding 7 05.12.2023 | BASF Material Solutions for Power Electronics 60 dB Coatings / Hybrid films Steel fiber fillers Performance Carbon fillers Cost Aluminum reference Weight Density Requirements and Solutions - Busbars Main technical requirements Main technical requirements Busbar technology direct overmolding Color black or uncolored Stiffness / strength Max. service temperature (>150°C) Electrical properties at high temperatures Thermo shock performance Other requirements 8 Busbars in HV power electronics moderate high important due to high service temperature high media contact, V0, CTI Ultramid® A3U44G6 Ultramid Advanced® N3U41G6 UL94 V0 at 0.4 mm UL94 V0 at 0.4 mm 05.12.2023 | BASF Material Solutions for Power Electronics Requirements and Solutions - Busbars Thermo-shock performance Parts with cracks after thermal cycle test Stress cracking is depends on several factors: ◼ Temperatures of thermal cycle test Design rules to avoid stress cracking: ◼ The thinner the wall thickness the better ◼ Number of cycles ◼ No sharp edges of the lead frame or at openings ◼ Geometry of busbar ◼ ◼ Thickness of the insulation Fiber orientation has an influence → right selection of injection point ◼ Material properties like CLTE, elongation at break ◼ Openings for relaxation of stresses, if possible and allowed 9 05.12.2023 | BASF Material Solutions for Power Electronics Requirements and Solutions - Busbars Simulation support for thermo-shock Flow analysis Thermal stress analysis Fiber orientation Recommended products Customer benefits Product Polymer Flammability CTI ◼ Ultramid® A3U44G6* PA66-GF30 FR(40) V-0 (0.4 mm) 600 Ultramid® Adv N3U41G6* PA9T-GF30 FR(40) V-0 (0.4 mm) 600 Ultramid® B3U42G6* PA6-GF30 FR(40) V-0 (0.4 mm) 600 Ultradur® B4450 G5 HR* PBT-GF25 FR(53) V-0 (1.5 mm) 600 Ultramid® C3U* PA66/6-FR(30) V-0 (0.4 mm) 600 Elastollan® R 2600 FHF TPU-GF15-FR V-0 (3.0 mm) 600 Broadest material portfolio and expertise comprising PA6, PA66, TPU, PBT and PPA ◼ Simulation support for customer specific geometries ◼ BASF proprietary busbar tool for electrical and thermo-mechanical investigations * Available in orange color 10 05.12.2023 | BASF Material Solutions for Power Electronics Requirements and Solutions – IGBT housings Flame Retardancy ISO/IEC 17025 Certified Laboratory UL 94 HB HB Thickness >13 mm HB Thickness <3 mm HB Thickness 3 mm – 13 mm Pass - - Burning rate - ≤ 75 mm/min ≤ 40 mm/min Vertical Burning Test (UL 94 V), flame: 50 W V-0 V-1 V-2 Burning time of each individual test specimen ≤ 10 s ≤ 30 s ≤ 30 s Total burning time (10 flame applications) ≤ 50 s ≤ 250 s ≤ 250 s Burning and afterglow times after second flame application ≤ 30 s ≤ 60 s ≤ 60 s Combustion up to holding clamp (specimens completely burned) no no no Dripping of burning specimens (ignition of cotton batting) no no yes Horizontal Burning Test (UL 94 HB), flame: 50 W UL 94 V Ultramid® Advanced N3U41G6 UL 94 V0 ab 0.4 mm Ultradur® B4450G5 HR UL94 V0 at 1.5 mm 11 05.12.2023 | BASF Material Solutions for Power Electronics Flame extinguishes before 100 mm mark Requirements and Solutions – IGBT housings Relative Temperature Index ◼ Common value to evaluate long term material performance after ageing & temperature ◼ Different RTI values common (for different specimen thicknesses): RTI Elec. → Electrical – measuring dielectric strength RTI Imp. → Mechanical with impact – measuring tensile impact strength RTI Str. → Mechanical without impact – measuring tensile strength ◼ RTI Elec. most “important” value in electronics industry 12 Ultramid® TKR4340G6 Ultradur B4450G5 RTI Elec. 160 (0.4 mm) RTI 140 (0.4 mm) 05.12.2023 | BASF Material Solutions for Power Electronics Requirements and Solutions – IGBT housings Comparative Tracking Index CTI acc. to IEC 60112 ▪ ▪ ▪ ▪ ▪ Brominated sample with low CTI 13 CTI test simulates electric tracking by a wet contamination of the surface Surface tracking is simulated by a conductive test solution (CTI A: CaCl4) Sample is thermally decomposed by light arcs which reduce the electrical insulation ability CTI is the numerical value of the highest voltage without failure on five samples after 50 drops of test solution Maximum value acc. IEC 60112: CTI 600 ▪ Practical use of CTI → IEC 60664-1 Ultramid® One J 60X1 V30 Ultramid® Advanced T2340G6 Ultradur® B4450G5 HR CTI 600 CTI 600 CTI 600 05.12.2023 | BASF Material Solutions for Power Electronics Requirements and Solutions – IGBT housings Ultramid® and Ultradur® most innovative materials for IGBT housings Ultradur® B4450G5 Ultramid® TKR4340G6 Ultramid® N3U41G6 CTI 600 600 600 Potting option + + + Electric isolation ++ + ++ DC ++ + + 140°C 160°C 150°C Property RTI (elec. 0.8 mm) ++ Very good 14 05.12.2023 | BASF Material Solutions for Power Electronics + Good Sustainability offered by BASF – Measures Different examples Grey-to-green New technologies Alternative feedstocks Conventional furnace CO2 Naphtha Raw olefins 850°C Furnace Natural gas eFurnace Raw olefins Naphtha 850°C eFurnace Renewable energy Ørsted and BASF have signed a 25-year offshore wind power purchase agreement in Germany. 15 05.12.2023 | BASF Material Solutions for Power Electronics Use of Pyrolysis oil based on old tires compared to fossil-based oil. Use of biogas vs. natural gas to reduce the specific CO2 footprint. Demonstration plant with 6 megawatts input of renewable electrical energy . Unique service portfolio Ultratest®, Ultrajoin®, Ultrasim® and electrical testing GWFI UL 94 V-0 Materials and Parts Testing Ultratest®, Ultrajoin® ISO/IEC 17025 Certified Laboratory UL 94 GWIT 16 GWFI HWI 05.12.2023 | BASF Material Solutions for Power Electronics CTI Simulation Engineering Ultrasim® Ultrasim® - an anisotropic, nonlinear simulation service for customers. Molded - BASF app for fast filling analyses. IPT Electrical Testing Comparative Tracking Index (CTI) inhouse testing for voltages to 600 V. Inclined Plane Tracking (IPT) for higher voltages (acc. UL746 A /ASTM standard). Get in contact with us patrick.frey@basf.com 17 jasmina.simon@basf.com jochen.seubert@basf.com thomas.bayerl@basf.com 05.12.2023 | BASF Material Solutions for Power Electronics
